semiconductor Handling - Grip Ring Magazines / Expansion Ring Magazines

Used For:	Surface Finishes:	Options:	When Inquiring Specify:
In-Line Wafer Handling on Grip Ring / Expander Rings Wafer Back Grinding Wafer Dicing Wafer / Die Sort Wafer / Die Pick & Place	Anodize - Non Conductive (Colors) Alodine - Conductive (Colors) Decoral - Conductive (Colors) Electroless Nickel Plating - Conductive Hardcoat - Non Conductive (Colors)	Length to Suit Lead-ins for Ring Acceptance (Standard on ALL Magazines) Dust Covers Handle Custom Machining Custom Engraving Custom Magazines upon request x	Grip Ring O.D. Grip Ring Thickness Mylar / Film Thickness

Used For:

Surface Finishes:

Options:

When Inquiring Specify:

In-Line Wafer Handling on Grip Ring / Expander Rings

Wafer Back Grinding

Wafer Dicing

Wafer / Die Sort

Wafer / Die Pick & Place

Anodize - Non Conductive (Colors)

Alodine - Conductive (Colors)

Decoral - Conductive (Colors)

Electroless Nickel Plating - Conductive

Hardcoat - Non Conductive (Colors)

Length to Suit

Lead-ins for Ring Acceptance
(Standard on ALL Magazines)

Dust Covers

Handle

Custom Machining

Custom Engraving

Custom Magazines upon request
x

Grip Ring O.D.

Grip Ring Thickness

Mylar / Film Thickness